Semiconductor manufacturing is an energy-intensive industry, consuming vast amounts of water, electricity and chemical materials. While metrology plays a crucial role in ensuring precision and yield, it also contributes to the environmental footprint of fabrication facilities. As sustainability becomes a growing priority, the industry is adapting metrology tools and techniques to minimize waste, reduce energy consumption and promote greener manufacturing processes. Erik Hosler, an expert in semiconductor process optimization, recognizes that sustainable metrology practices are key to balancing technological advancements with environmental responsibility.
Reducing Chemical Waste in Semiconductor Metrology
Many traditional metrology techniques rely on chemical-based processes for wafer inspection, defect analysis and material characterization. Wet etching, Chemical-Mechanical Polishing (CMP) and certain deposition techniques contribute to hazardous waste production, requiring costly treatment and disposal. To combat this, fabs are adopting non-destructive metrology methods that eliminate or significantly reduce the use of hazardous chemicals.
A major shift is occurring with the use of new semiconductor materials that reduce reliance on toxic substances in manufacturing. Erik Hosler explains, “Working with new materials like GaN, SiC, graphene and other two-dimensional materials is unlocking new potential in semiconductor fabrication and with it, new semiconductor equipment platforms will likely be required, like accelerator-based light sources.” As these materials become more widely adopted, metrology tools are evolving to ensure accurate inspection and quality control while reducing the environmental impact of fabrication processes.
Energy Efficiency in Metrology Tools
Semiconductor fabs operate high-precision metrology equipment that requires continuous power for wafer inspections, defect analysis and material characterization. Traditional metrology tools, particularly those used in extreme ultraviolet (EUV) lithography, can be energy-intensive, contributing to high operational costs and carbon emissions. To mitigate this, fabs are implementing AI-driven process optimizations that streamline inspections and minimize unnecessary power consumption.
Water Conservation in Metrology Processes
Semiconductor manufacturing is highly water-intensive, with fabs requiring ultrapure water (UPW) for wafer cleaning, cooling and contamination control. Metrology inspections, particularly those involving wet chemistry processes, consume significant amounts of water, increasing both costs and environmental impact.
To address this, fabs are adopting closed-loop water recycling systems, which filter and reuse water multiple times before disposal. Additionally, the rise of dry metrology techniques, such as optical interferometry, ellipsometry and scatterometry, is reducing dependence on water-based cleaning and inspection processes. By combining water-efficient technologies with improved recycling methods, fabs can lower their overall water consumption while maintaining metrology precision.
A Greener Future for Semiconductor Metrology
As semiconductor manufacturing continues to evolve, sustainable metrology practices will play an increasingly vital role in reducing environmental impact. The shift toward non-destructive testing, AI-driven energy optimizations and water-efficient inspection techniques is paving the way for greener fabrication facilities.
By embracing eco-friendly metrology solutions, semiconductor companies are improving efficiency and contributing to global sustainability efforts. These innovations ensure that the industry can continue pushing the boundaries of technology while reducing waste, conserving energy and protecting natural resources.
